[oe-commits] : dsplink: bump PR for packaging change

[OE GIT Trial]

Module: OE.dev
Branch: master
Commit: bab8c00529ac6f7fabdcedb932da49e351b0261b
URL:    http://gitweb.openembedded.net//OE.dev.git/?a=commit;h=bab8c00529ac6f7fabdcedb932da49e351b0261b

Author:  <koen at openembedded.org>
Date:   Thu Jul 31 09:48:20 2008 +0000

dsplink: bump PR for packaging change 

---

 packages/dsplink/dsplink_1.50.bb |    2 +-
 1 files changed, 1 insertions(+), 1 deletions(-)

diff --git a/packages/dsplink/dsplink_1.50.bb b/packages/dsplink/dsplink_1.50.bb
index 965c735..62a352e 100644
--- a/packages/dsplink/dsplink_1.50.bb
+++ b/packages/dsplink/dsplink_1.50.bb
@@ -1,6 +1,6 @@
 require dsplink.inc
 
-PR = "r9"
+PR = "r10"
 PE = "1"
 PV = "1.50"