[oe-issues] [Bug 2361] New: MDK3v1
bugzilla-daemon at tinman.treke.net
bugzilla-daemon at tinman.treke.net
Tue May 22 19:02:29 UTC 2007
http://bugs.openembedded.org/show_bug.cgi?id=2361
Summary: MDK3v1
Product: Openembedded
Version: Angstrom
Platform: All
URL: http://homepages.tu-darmstadt.de/~p_larbig/wlan
OS/Version: All
Status: NEW
Severity: normal
Priority: P2
Component: Distributions
AssignedTo: openembedded-issues at lists.openembedded.org
ReportedBy: r.farina at adelphia.net
QAContact: tinderbox-oe at gmx.net
Blocks: 2194
Created an attachment (id=1514)
--> (http://bugs.openembedded.org/attachment.cgi?id=1514)
main reciepe
mdk3 is a cross-platform, cross-os proof of concept 802.11 attack tool.
--
Configure bugmail: http://bugs.openembedded.org/userprefs.cgi?tab=email
------- You are receiving this mail because: -------
You are the assignee for the bug.
More information about the Openembedded-issues
mailing list